Adapted solutions to the challenges of the photonics market
The photonics market is characterized by a long time-to-market for new products, ranging from one to two years, while the lifespan of these products is often less than three years. To address the challenges faced in manufacturing such products, Ciposa draws on the modularity of these standard platforms to provide specific solutions.
µ-Assembly
The complexity of automated µ-assembly processes requires very high precision in motion control and resolution. To minimize influencing variables, Ciposa integrates metrology and bonding capability directly into its micromanipulators, creating a unique tool for measurement, alignment and bonding of optical components in an integrated manner. This compact configuration also allows for active alignment in confined workspaces.
Passive and active alignment
This is based on the experience in passive alignment, now supplemented by further active alignment functionalities for which Ciposa has developed specific algorithms.
Ciposa provides intelligent alignment systems that utilize all available metrology signals such as optical power or two-dimensional intensity profiles to achieve optimized positioning. For demanding applications, such as fiber attachment to photonic integrated circuits (PIC), Ciposa uses multiple sensors and up to three different alignment tools. This enables efficient optimization of first-light search strategies and signals.
Bonding
In precision assembly, the bonding process often plays a critical role as it ensures the final position of individual components. To address the diverse production challenges, Ciposa excels in designing reliable dispensing solutions equipped with automated calibration and cleaning functions for maximum dispensing reliability. This ensures impeccable dosing precision, avoiding any excess or shortage that could affect alignment and optical performance. The perfect uniformity of adhesive application ensures homogeneous distribution, thus preventing stress points and refractive index variations.
Advanced machine vision
At Ciposa, our advanced machine vision technology enhances precision and efficiency in photonics manufacturing. With capabilities like precision alignment, Ciposa ensures accurate positioning of components. Its quality control systems automate defect inspection to guarantee reliability, while process monitoring maintains consistent quality in real time. Additionally, automated testing measures optical properties to meet industry standards, and process feedback adjusts manufacturing processes dynamically for optimal outcomes. Its solutions also integrate robotics guidance to streamline assembly line tasks and employ 3D imaging for accurate measurements. These innovations significantly improve product quality and operational efficiency.
User application software platform
The software that drives Ciposa's automated machines is designed to optimize the work of operators and engineers, aiming to be simple and user-friendly. In addition to ensuring maintainability, Ciposa has developed and tested features that allow the integration of modules specific to photonics’ needs, such as active alignment with its first-light search or sub-micrometric manipulation.
With these solutions, Ciposa is committed to meeting the challenges of the photonics market, ensuring optimal performance and increased reliability for its clients.